Auto Optical Alignment WDS 650 bga chip soldering and desoldering machine for iphone Laptop Motherboard Repair Machine

12,090.47

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Availability: 4999 in stock SKU: 32883630035 Category: Tag:

Description

Auto Optical Alignment WDS 650 bga chip soldering and desoldering machine for iphone Laptop Motherboard Repair Machine

Product Features:

Independent 3 heating zones temperature control system
1.The upper and lower hot air heating,which can heat up at the same time from the top of he component to the bottom of the PCB;bottom IR heating,temperature precision control within ±1℃.8 segment temperature control independently.
2.Hot air district heating for BGA and PCB at the same time,and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed、set and correct on the touch screen at any time.
Parameter
Name:
WDS-620 BGA rework station
Power Supply:
Max 5300W
Voltage :
AC 110V/220V±10% 50/60Hz
PCB size:
Max 450×390mm Min 10×10 mm
Type :
Semi-Automatic
Color :
White & Blue
Suits for:
Mobile phone Chip Repairing
Heater power:
Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
Applicable chips:
Max 80×80mm Min 1×1 mm
Overall dimension:
650*630*850mm
Chips:
Max 60×60mm Min 1×1 mm
Weight:
60KG
Locating way
V shape slot,PCB support jigs can adjust,laser light do fast centering and position
Electrical material
Driving motor+PLC smart temp.controller+color touch screen
Working mode
remove ,mount,weld,semi-auto,manual

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