Type

CPU / Microprocessor

Market segment

Desktop

Family

Model number  ? 

CPU part numbers

• CM8068403874409 is an OEM/tray microprocessor

• CM8068403874410 is an OEM/tray microprocessor

• BX80684I59600KF is a boxed processor (English version)

• BXC80684I5960KF is a boxed processor (Chinese version)

Frequency ? 

3700 MHz

Maximum turbo frequency

4600 MHz

Low power frequency

800 MHz

Bus speed ? 

8 GT/s DMI

Clock multiplier ? 

37

Package

1151-land Flip-Chip Land Grid Array

Socket

Socket 1151 / H4 / LGA1151

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Introduction date

January 7, 2019

Price at introduction

$262 (OEM)
$263 (box)

Microarchitecture

Coffee Lake

Processor core  ? 

Coffee Lake-S

Core steppings  ? 

P0 (SRFAD)
R0 (SRG12)

Manufacturing process

0.014 micron

Data width

64 bit

The number of CPU cores

6

The number of threads

6

Floating Point Unit

Integrated

Level 1 cache size  ? 

6 x 32 KB 8-way set associative instruction caches
6 x 32 KB 8-way set associative data caches

Level 2 cache size ? 

6 x 256 KB 4-way set associative caches

Level 3 cache size

9 MB 12-way set associative shared cache

Physical memory

128 GB

Multiprocessing

Uniprocessor

Extensions and Technologies

• MMX instructions

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSSE3 / Supplemental Streaming SIMD Extensions 3

• SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 

• AES / Advanced Encryption Standard instructions

• AVX / Advanced Vector Extensions

• AVX2 / Advanced Vector Extensions 2.0

• BMI / BMI1 + BMI2 / Bit Manipulation instructions

• F16C / 16-bit Floating-Point conversion instructions

• FMA3 / 3-operand Fused Multiply-Add instructions

• EM64T / Extended Memory 64 technology / Intel 64  ? 

• VT-x / Virtualization technology  ? 

• VT-d / Virtualization for directed I/O

• TBT 2.0 / Turbo Boost technology 2.0  ? 

• TSX / Transactional Synchronization Extensions

Security Features

• NX / XD / Execute disable bit  ? 

• MPX / Memory Protection Extensions

• SGX / Software Guard Extensions

• SMAP / Supervisor Mode Access Prevention

• SMEP / Secure Mode Execution Protection

Low power features

• Core C1/C1E, C3, C6, C7, C8, C9 and C10 states

• Package C2, C3, C6, C7, C8, C9 and C10 states

• Enhanced SpeedStep technology  ? 

Integrated graphics

None

Memory controller

The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR4-2666
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 42.7

Other peripherals

• Direct Media Interface 3.0 (4 lanes)

• PCI Express 3.0 interface (16 lanes)

Minimum/Maximum operating temperature  ? 

0°C (case temperature) – 65°C (case temperature) [1]100°C (Digital Thermal Sensor)

Thermal Design Power ? 

95 Watt